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פורטל תעשיית השבבים בישראל מבית מגזין |
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דף בית 
בישראל הודעות לעיתונות Reltech 8000
בישראל הודעות לעיתונות Reltech 8000
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New Product launch at Chip-Ex 2012, Tel Aviv 2nd May 2012 Reltech launches its new 8000 series of High Power HTOL Systems designed for the High Temperature Operating Life Testing of low geometry semiconductor devices. The system is designed for use by Independent Test Houses and Semiconductor companies operating their own Quality & Reliability Laboratories. Reltech 8014 HTOL System Features
Individual DUT Temperature Measurement & Control
iSocket™Technology Open Rack – Room Temperature (RTBI) non chamber design
Easy to load trays on telescopic slides
DUT Monitoring with Auto shut down
Multi DUT type HTOL Testing
Remote System & HTOL monitoring
Today’s low geometry semiconductor devices require a different approach to performing High Temperature Operating Life (HTOL) and “Burn-In” testing. Core Leakage currents vary greatly between device die, even when from the same wafer and are significantly higher than those of larger geometry devices. These leakage currents result in self-heating within the device and increased junction temperatures (Tj). In order to control the junction temperature to within acceptable limits and to increase product yield, it is necessary to control the temperature of each device independently. This is not possible in conventional chamber based HTOL systems. The Reltech 8000 series HTOL system incorporating iSocket™technology, provides the highest level of thermal control possible for High Temperature Operating Life Testing and Burn-In of the very latest low geometry semiconductor devices. -Our representatives in Israel Mr Ran Sagiv |
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בניית אתרים | בעצם גלישתכם באתר הכנם מסכימים לתנאי השימוש בו - לחצו כאן לקריאת תנאי השימוש - כל הזכויות שמורות Chiportal (c) 2010 |
