Today’s low geometry semiconductor devices require a different approach to performing High Temperature Operating Life (HTOL) and “Burn-In”. Core Leakage currents vary greatly between device die, even when from the same wafer, and are significantly higher than those of larger geometry devices. These leakage currents result in self-heating within the device and increased junction temperatures (Tj).

iSocket™ Technology

Open Rack – Room Temperature (RTBI) non chamber design

Easy to load trays on telescopic slides

Individual DUT Temperature Measurement & Control

DUT Monitoring with Auto shut down

Multi DUT type HTOL Testing

Remote System & HTOL monitoring- Customer access via VPN

Capacity: 14 HTOL Tray Slots

DUT Capacity: Typical 14 x 12 = 168 DUT’s

DUT Power : up to 65W per DUT

I/O: 192 ( 2 x 96 way IDC)

Signal Zones: 14 - 1 per Driver Card Slot

Power Zones: 14 - 1 per HTOL Tray

PSU Qty Volts Current

V1 4 0.6v-3.6v 120A

V2 2 0.75v- 5.0v 10A

V3 2 0.75v- 5.0v 10A

V4 2 0.75v- 5.0v 10A

24 Vector channels 8Mb Vector depth

5MHz - Vector frequency 200mA driver per channel

2 Voh levels – 1.0v – 5v Vector looping

20 DUT signal monitor channels Test programme conversion

 DUT Case Temperature (Tc)

 DUT Junction Temperature (Tj)

Voltage Monitoring: V1 - V4 per group of DUT’s

with auto shut down of all 4 DUT’s

• Current Monitoring: PSU 1-4 per DUT with auto

shut down of all 4 DUT’s

• Monitoring frequency: 100mS

• DUT shut down time: 1.0S

• DUT Monitoring: 20 channels

(typically 1 per DUT) Hi, LO or Activity)